電子暨半導體設備標竿計畫
- 更新日期:2025-06-11
因應次世代顯示器、高階載板、AI晶片、HPC高速運算晶片以及車用晶片生產需求,本計畫將著重於協助國內電子及半導體設備業者提升自主技術能力,並結合產業創新平台主題式計畫,補助業者發展終端客戶所需標竿性關鍵設備,並協助國內自主設備通過客戶品質驗證,提升我國設備產業自主能力。另透過「以大帶小」由設備廠商帶領國內機械加工業者,共同建立安全且穩固的自主供應鏈,以強化整體產業韌性。
In response to the production demands of next-generation displays, advanced substrates, AI chips, HPC high-speed computing chips, and automotive chips, this project will focus on assisting domestic electronics and semiconductor equipment manufacturers in enhancing their technological capabilities. By integrating with Taiwan industry innovation platform’s thematic projects, it aims to help companies develop benchmark key equipment required by end customers and support domestic equipment in passing customer quality verifications, thereby strengthening the self-sufficiency of Taiwan's equipment industry.
In addition, through a "leading the small with the big" approach, equipment manufacturers will guide local precision machining suppliers to jointly establish a secure and stable domestic supply chain, thereby reinforcing the overall resilience of the industry.
- 機械產業科 - 謝尚宇
- 金屬機電產業組
- 聯絡人:謝先生
- 電話:02-27541255 #2129
- Email:syshie2@ida.gov.tw
- 財團法人金屬工業研究發展中心
- 聯絡人:袁先生
- 電話:07-3517161 #6345
- Email:howe1502@mail.mirdc.org.tw