Industrial Development Administration, Ministry of Economic Affairs

The Project for Emerging Materials Promotion of Heterogeneous Integration Chiplet

To breakthrough the line-width limits of semiconductor manufacturing processes, a new packaging type named heterogeneous integration chiplet has been proposed. It will serve as one of the solutions for reducing chip size, low power consumption and enhancing high efficiency, quality-of-result and time-to-market performance.

Taiwan heavily relies on imported emerging materials for heterogeneous integration chiplets, therefore, proactively laying out the groundwork for the development of emerging materials is of vital concern. It will strengthen domestic technological capabilities and maintain Taiwan’s competitive advantage in advanced material industry.

This project will conduct a technical assessment of emerging materials for heterogeneous integration chiplet, including but not limited to noise suppression materials, interposer layer, conductor connection materials, and low Dk loss materials. It will establish from material certification technology (α-site) to standardizing new material acceptance specifications. α-site aim to facilitate collaboration between material suppliers and end users. It may accelerate the research and development process.

Guiding domestic manufacturers to invest in the research and development of emerging materials technology is also very important. Experts will assist these manufacturers in identifying technological bottlenecks and provide suggestion which will expedite the development process.