Industrial Development Administration, Ministry of Economic Affairs

Heterogeneous integrated chip key materials guidance and promotion plan

⌕

Heterogeneous integrated chip key materials guidance and promotion plan

X

Heterogeneous integrated chip key materials guidance and promotion plan

A new packaging type called heterogeneous integration chips has been proposed to overcome the linewidth limits of semiconductor manufacturing processes. It will serve as one solution for reducing chip size and enhancing performance. Taiwan relies on imports for emerging materials for heterogeneous integration chips. Proactively laying the groundwork for the development of emerging materials is crucial. It will strengthen domestic technological capabilities and maintain our country's competitive advantage in the advanced material industry.

This project will conduct a technical assessment of emerging materials for heterogeneous integration chiclets, including but not limited to noise suppression materials, interposer layer, conductor connection materials, and low Dk loss materials. It will establish material certification technology (α-site) to standardize new material acceptance specifications. The α-site aims to facilitate collaboration between material suppliers and end users; It could accelerate the research and development process. Guiding domestic manufacturers to invest in the research and development of emerging materials technology is also important. Experts will assist these manufacturers in identifying technological bottlenecks and provide suggestions that lead to promoting the development process.