The "Smart Chip Terminal Value-Added Cross-Industry Transformation Plan" aims to foster cross-domain co-creation of intelligent terminal solutions and catalyze innovative industrial transformation. By orchestrating supply and demand, the program leverages a pre-order-driven guidance mechanism to identify and aggregate diverse industrial needs, fostering clusters of shared requirements in key sectors. These insights serve as a strategic roadmap for the development of edge computing systems, smart modules, and terminal solutions. For technology providers, the initiative establishes a micro-model repository to "intelligentize" electronic modules, devices, and software services. This facilitates robust hardware-software integration and enhances the intelligence ratio of terminals. Furthermore, by leveraging international funding and export channels, the plan seeks to expand the smart terminal economy's global market foothold. Ultimately, by mobilizing System Integrators (SIs) through technical facilitation, the plan bridges the gap between supply and demand, delivering value-added cross-domain applications that benefit the entire industrial ecosystem.
- Electronics and Information Technology Industry Division
- Contact person:Ms. Chen
- Electronics and Information Technology Industry Division
- Contact person:Ms. Chen
- Phone:+886-2-2754-1255 ext.2240
- Email：ttchen@ida.gov.tw
- Institute for Information Industry
- Contact person:Ms. Tsui
- Phone:+886-2-66072574
- Email：nicolechtsui@iii.org.tw
