A service platform of testing and verification for compound semiconductor
- Modified at：2025-03-21
This project is dedicated to establishing a testing platform for automotive-grade silicon carbide (SiC) power modules in compliance with the AQG-324 standard. It also aims to achieve third-party accredited testing capabilities (ISO 17025), aligning with the latest international standards and testing regulations. By overcoming product verification barriers, this initiative will drive the development of the emerging compound semiconductor industry in Taiwan. This project is devoted to the following two tasks:
1. Compound Semiconductor Testing Platform:
Establishment of four testing methods and procedures in accordance with the AQG-324 reliability standard for automotive power modules.
2. Compound semiconductor test service
Collaboration with the Power Electronics System Consortium (PESC) to provide testing services for four companies.
- Contact Organization：Electronics and Information Technology Industry Division
- Contact Person：Ms. Sheu
- Contact Phone：886-2-2754-1255 ext. 2245
- Email：mssheu@ida.gov.tw
